xilinx package drawings

PDF Xilinx PK381 324 Ball Chip-Scale BGA (CSG324) Package, 0.80 mm Pitch ...PDF

Xilinx PK381 324 Ball Chip-Scale BGA (CSG324) Package, 0.80 mm Pitch, Package Drawing PK381 (v1.1) November 23, www.xilinx.com 1 © Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks o f Xilinx in the United States and other countries.

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4672 - Packaging - What is the alloy composition of the solder ... - Xilinx

Go to Documentation --> Package Drawings (under the Hardware section of Technical Documentation). Package key: BG: Ball Grid Array (BGA) package . FG, FT: Fine pitch BGA package . CS, CP: Chip-scale package . FF: Flip-Chip BGA package . The solder column composition for Ceramic Column Grid Array packages designed for Hi-rel devices (CG & CF

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Z036 SIGNAL LAMP XB2BVM4LC | xilinx package drawings

socket liner at mill xilinx ug583 hp cone crusher crusher wear inner eccentric bushing concave hp 400 crusher manual. barmac crushers bush xm-120 dynamic measurement module tool box h&s 3000,4000 . head bushing for a kemco jaw crushers for sale in the usa korloy insert grade chart. New Balance Kid's 574 V1 Classic

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Xilinx PQFP (PQ160/PQG160) Package Drawing

Xilinx PQFP (PQ160/PQG160) Package Drawing Author: Xilinx, Inc. Subject: Package drawing of 160-Pin PQFP (PQ160/PQG160) Keywords: pq160, pqg160, 160 pin, PQFP, package,

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Device Packaging and Thermal Characteristics - Michigan

Package Drawings Package drawings are available online at the Package Drawings page on xilinx.com . Specifications and definitions Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").

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Xilinx Fine-Pitch BGA (FG324/FGG324) Package Drawing

Xilinx Fine-Pitch BGA (FG324/FGG324) Package Drawing Author: Xilinx, Inc. Subject: Package drawing of 324-Ball Fine-Pitch BGA, 1.00mm Pitch (FG324/FGG324) Keywords: fg324, fgg324, 324 ball, fine pitch, package, mechanical drawing,

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PDF Xilinx TQFP (TQ144/TQG144) Package DrawingPDF

Xilinx TQFP (TQ144/TQG144) Package Drawing Author: Xilinx, Inc. Subject: Package drawing of 144-Pin TQFP (TQ144/TQG144) Keywords: tq144, tqg144, 144 pin, TQFP, package, mechanical drawing, specification Created Date: 1/24/2000 9:44:00 AM

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7 Series FPGAs Packaging and Pinout

Replaced Figure 4-16: FG484 and. FGG484 Wire-bond Fine-Pitch BGA Package Specification for Artix-7 FPGAs, page 273 with a new drawing with 

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PDF Xilinx Heat Sink PQFP (HQ208/HQG208) Package DrawingPDF

Xilinx Heat Sink PQFP (HQ208/HQG208) Package Drawing Author: Xilinx, Inc. Subject: Package drawing of 208-Pin Heat Sink PQFP (HQ208/HQG208) Keywords: hq208, hqg208, 208 pin, heat sink, PQFP, package, mechanical drawing, specification Created Date: 1/24/2000 9:44:00 AM

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PDF Xilinx PQFP (PQ44/PQG44) Package DrawingPDF

Xilinx PQFP (PQ44/PQG44) Package Drawing Author: Xilinx, Inc. Subject: Package drawing of 44-Pin PQFP (PQ44/PQG44) Keywords: pq44, pqg44, 44 pin, PQFP, package, mechanical drawing, specification Created Date:

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PDF Xilinx VQFP (VQ100/VQG100) Package DrawingPDF

2 www.xilinx.com PK012 (v1.2.1) February 26, 2007 VQFP (VQ100/VQG100) Package Revision History The following table shows the revision history for this document. Date Version Revision 6/18/04 1.2 Xilinx Initial Release 2/26/07 1.2.1 Minor update to clarify Note #2.

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